KEY RESPONSIBILITIES
· Lead packaging NPI activities: conduct design reviews, review BOMs, perform technical risk assessments, define process flows, release NRE/LRB POs, and establish project timelines.
· Plan and review DOEs with subcontractors to characterize and validate packaging processes; oversee qualification builds and track reliability performance to ensure HVM readiness.
· Oversee assembly processes of HVM products at subcon sites, ensuring adherence to specifications, yield targets, and quality standards.
· Support NPI-to-HVM transitions, ensuring process readiness, documentation completeness, and yield stability at subcon sites.
· Perform and manage second-sourcing activities covering device, material, and site qualification.
· Drive continuous improvement on assembly yield, outgoing quality/sort (O/S), and in-process controls to achieve zero CARs, MRBs, and field returns.
· Execute low-yield lot containment; provide disposition and risk assessments for yield-discrepant lots; conduct failure analysis, root cause analysis, and on-site reject verification.
· Follow through on all ongoing programs (development qualifications, engineering builds, urgent builds) and critical subcon shipment requirements.
· Monitor reliability performance, review qualification reports, and manage 8D corrective actions for assembly-related failures.
· Prepare and maintain assembly specifications, process documents, and packaging SWIs; generate handover reports and endorse key learnings to the Assembly Engineering team.
· Represent the Packaging team in PDT meetings, management reviews, and subcontractor QBRs; provide packaging updates, build plans, and material plans.
· Support QA during supplier audits at assembly subcontractors, providing technical input and ensuring findings are resolved.
· Leverage AI and data analytics tools to analyze yield and reliability data, automate routine workflows, and maintain dashboards for real-time NPI and subcon visibility.
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