Senior/Staff Thermal Simulation Engineer

There is energy here…energy you can feel crackling at any of our international locations. It’s an energy generated by enthusiasm for our work, for our teams, for our results, and for our customers. Lattice is a worldwide community of engineers, designers, and manufacturing operations specialists in partnership with world-class sales, marketing, and support teams, who are developing programmable logic solutions that are changing the industry. Our focus is on R&D, product innovation, and customer service, and to that focus, we bring total commitment and a keenly sharp competitive personality.

Energy feeds on energy. If you flourish in a fast paced, results-oriented environment, if you want to achieve individual success within a “team first” organization, and if you believe you can contribute and succeed in a demanding yet collegial atmosphere, then Lattice may well be just what you’re looking for.

Accountabilities: 

• Perform thermal simulations and analysis for electronic components, PCBs, and systems using tools such as ANSYS Icepak, FloTHERM, or similar CFD software.
• Develop thermal models for complex systems including IC packages, boards, and enclosures.
• Collaborate with electrical, mechanical, and packaging engineers to optimize thermal performance.
• Validate simulation results through experimental testing and correlated data.
• Provide design recommendations to improve thermal reliability and efficiency.
• Support thermal design for high-power electronics, data centers, or automotive applications.
• Document analysis results and present findings to cross-functional teams.
• Create simulation models and develop simulation methodology for thermal simulation.
• Lead the design and development of custom circuits for FC, WB, FO and advance package.
• Work with suppliers on package DFM and internal T-spec creation.

Qualifications:

• Must have an MS or PhD in Mechanical Engineering, Thermal Engineering, or related field.
• Qualified candidates must have 5 years or above of thermal simulation and analysis.
• Strong knowledge of heat transfer principles (conduction, convection, radiation).
• Proficiency in CFD tools (ANSYS, FloTHERM, COMSOL) and scripting for automation (Python, MATLAB).
• Familiarity with electronics cooling, thermal interface materials, and reliability standards.
• Experience in custom layout engineering and package design.
• Experience in substrate material roadmap management.
• Knowledge in FC, WB and QFN package process and integration.
• Communication skills are a must as this person will interact with engineers in different disciplines as well as with members of management.